Request exact-unit photography.
No unverified model image substituted.
GIGABYTE H223-S10-AAP1 — Rack & blade servers
Inherited technical record
Price and availability: Request quotation
Download editable RFQ checklist ↓A technical record does not certify stock, condition, current orderability or a factory-approved BOM.
GIGABYTE H223-S10-AAP1 — technical record and sourcing reference. This model carries 24 recorded technical fields, including dimensions (wxhxd, mm) 2U 3-Node - Front access 447.8 x 87.5 x 500, motherboard MS13-HD0, cpu 5th Generation Intel® Xeon® Scalable processors 4th Generation Intel® Xeon® Scalable processors Intel® Xeon® CPU Max Series Single processor per node - With 1 x PCIe card per node at 35°C ambient, TDP up to 350 W - With 2 x PCIe cards per node at 30°C ambient, TDP up to 350 W - With 3 x PCIe cards per node at 35°C ambient, TDP up to 300 W - With 4 x PCIe cards per node at 30°C ambient, TDP up to 300 W ASTER RACKIT confirms price, stock and condition inside the quotation process — treat this page as the identity baseline.
This record identifies H223-S10-AAP1 in the GIGABYTE rack & blade servers catalog. Its classification is model. Preserve the full identifier when comparing offers: suffixes, revisions and assembly contents are part of the purchasing question.
Prepare an ASTER RACKIT sourcing request for H223-S10-AAP1. Record the exact part number, required quantity and destination system. Review the listed evidence and confirm the offered unit, accessories and compatibility before purchase. Use the technical record to prepare an inquiry rather than as evidence that an item is available, tested, licensed or covered by a particular warranty. Inherited fast-shipping and stock language is not carried into this catalog's commercial fields.
Each field states its evidence status. Inherited and title-derived values remain unverified; reviewed OEM facts do not certify an offered configuration.
| Field | Recorded value | Source snapshot |
|---|---|---|
| Dimensions (WxHxD, mm) | 2U 3-Node - Front access 447.8 x 87.5 x 500 | model-products unverified_inherited |
| Motherboard | MS13-HD0 | model-products unverified_inherited |
| CPU | 5th Generation Intel® Xeon® Scalable processors 4th Generation Intel® Xeon® Scalable processors Intel® Xeon® CPU Max Series Single processor per node - With 1 x PCIe card per node at 35°C ambient, TDP up to 350 W - With 2 x PCIe cards per node at 30°C ambient, TDP up to 350 W - With 3 x PCIe cards per node at 35°C ambient, TDP up to 300 W - With 4 x PCIe cards per node at 30°C ambient, TDP up to 300 W | model-products unverified_inherited |
| Socket | 3 x LGA 4677 Socket E | model-products unverified_inherited |
| Chipset | Intel® C741 | model-products unverified_inherited |
| Memory | 24 x DIMM slots Support DDR5 RDIMM 8-Channel memory per processor 5th Gen Intel® Xeon®: Up to 5600 MT/s 4th Gen Intel® Xeon®: Up to 4800 MT/s Intel® Xeon® Max Series: Up to 4800 MT/s | model-products unverified_inherited |
| LAN | Front: 2 x CMC Management LAN | model-products unverified_inherited |
| Video | Integrated in ASPEED® AST2600 x 3 - 3 x Mini-DP | model-products unverified_inherited |
| Storage | Front hot-swap: 6 x 9.5mm E1.S Gen4 NVMe Internal M.2 (CFPH010 x 3): 3 x M.2 (2242/2260/2280/22110), SATA, from PCH | model-products unverified_inherited |
| SAS | N/A | model-products unverified_inherited |
| RAID | Onboard VROC key header | model-products unverified_inherited |
| PCIe Expansion Slots | Riser Card CRSH02D x 3: - 6 x FHHL x16 (Gen5 x16) Riser Card CRSH02E x 3: - 3 x LP x16 (Gen5 x16) - 3 x LP x16 (Gen5 x8) | model-products unverified_inherited |
| Front I/O | 2 x CMC ports 1 x CMC status LED I/O board - CFPH010 x 3: 3 x USB 3.2 Gen1 ports (Type-C) 3 x Mini-DP 3 x Power buttons with LED 3 x System status LEDs 3 x ID LEDs | model-products unverified_inherited |
| Rear I/O | N/A | model-products unverified_inherited |
| Backplane Board | Speed and bandwidth: PCIe Gen4 x4 | model-products unverified_inherited |
| Security Modules | 1 x TPM header with SPI interface - Optional TPM 2.0 kit: CTM010 | model-products unverified_inherited |
| Power supply | 1+1 3000 W 80 PLUS Titanium redundant power supplies [1] AC Input: - 100-127V~/ 15.5A, 50-60Hz - 200-220V~/ 15.5A, 50-60Hz - 220-240V~/ 15.5A, 50-60Hz DC Input: (Only for China) - 240Vdc/ 15.5A DC Output: - Max 1000W/ 100-127V~ +12.2V/ 81A +12Vsb/ 3A - Max 2600W/ 200-220V~ +12.2V/ 213A +12Vsb/ 3A - Max 3000W/ 220-240V~ or 240Vdc Input +12.2V/ 245A +12Vsb/ 3A [1] The system power supply requires C19 power cord. Power cords are not included. Specify suitable cords separately. | model-products unverified_inherited |
| System Management | ASPEED® AST2600 Baseboard Management Controller ASPEED® AST2520 Chassis Management Controller GIGABYTE Management Console web interface Dashboard HTML5 KVM Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.) Sensor Reading History Data FRU Information SEL Log in Linear Storage / Circular Storage Policy Hardware Inventory Fan Profile System Firewall Power Consumption Power Control Advanced power capping LDAP / AD / RADIUS Support Backup & Restore Configuration Remote BIOS/BMC/CPLD Update Event Log Filter User Management Media Redirection Settings PAM Order Settings SSL Settings SMTP Settings | model-products unverified_inherited |
| OS Certifications | Windows Server 2022 Windows Server 2025 | model-products unverified_inherited |
| System Fans | 4 x 80x80x38mm | model-products unverified_inherited |
| Operating Properties | Operating temperature: 10°C to 35°C Operating humidity: 8% to 80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20% to 95% (non-condensing) | model-products unverified_inherited |
| Weight | Net Weight: 17.2 kg Gross Weight: 27.38 kg | model-products unverified_inherited |
| Packaging Dimensions | 862 x 676 x 294 mm | model-products unverified_inherited |
| Packaging Content | 1 x H223-S10-AAP1 3 x CPU heatsinks 1 x Mini-DP to D-Sub cable 9 x CPU carriers 1 x L-shape Rail kit | model-products unverified_inherited |
Adding an item prepares a local RFQ line. It does not create a price offer, reserve inventory or submit an order.
Read the category procurement guide →Common project contexts where buyers request this rack & blade servers. Contexts inform the inquiry — they are not compatibility claims.
The H223-S10-AAP1 is a recorded GIGABYTE rack & blade servers identity (model). Recorded highlights: Dimensions (WxHxD, mm) 2U 3-Node - Front access 447.8 x 87.5 x 500; Motherboard MS13-HD0.
The record carries 24 technical fields, each with an evidence label. Reviewed fields come from OEM catalog evidence; unverified fields stay visibly marked and should be confirmed before purchase.
Add the record to the quote basket and send the inquiry — ASTER RACKIT confirms price, condition and availability in a written quotation.
No. Images are reference material only. Request exact-unit photography with serial numbers before committing to an order.
No explicit target-platform relationship is provided for this record. Brand, socket, capacity and visual resemblance alone must not be used to invent a compatibility claim.
Related records below are category neighbors. They are not approved replacement parts.
No server boot-screen image is attached to this record. Request product photographs and any diagnostic or entitlement record as separate evidence.
Facility reference scenes from our warehouse and test benches. They show the environment and handling standard for this equipment family — they are not photographs of the exact offered unit.
At acceptance, compare the delivered unit, labels and accessories with the approved list. Retain source revisions and receiving records for later maintenance.
| Source file | Source record | Evidence status |
|---|---|---|
| lib/model-products.json | gigabyte-model-h223-s10-aap1 | Inherited snapshot; not re-certified |
A product-specific OEM URL was not included in the source mapping. Obtain the current document and revision before order approval.
How evidence quality is classified →This is not a live stock feed. Confirm full identifier, condition, quantity, price and delivery scope in a written quotation.
No. Inherited fields and platform associations require review against the exact destination system and current manufacturer documentation.
Include the full identifier, quantity, destination, target platform, condition, accessories and evidence needed for acceptance.
No. Models, ordering configurations, options and reference labels are distinct record types. Ask which actual purchasing unit will be supplied.
GIGABYTE G593-ZD1-AAX1 — Rack & blade servers
OEM fields reviewed · see remaining checks
GIGABYTE D120-S3G — Rack & blade servers
Inherited technical record
GIGABYTE G150-B10 — Rack & blade servers
Inherited technical record
GIGABYTE G180-G00 — Rack & blade servers
Inherited technical record
GIGABYTE G190-G30 — Rack & blade servers
Inherited technical record
GIGABYTE G190-H44 — Rack & blade servers
Inherited technical record
Specify rack height, bay size and backplane options.
This guide adds the decisions, documents and next steps that support this page.
Server directory
Plan rack depth, rail kit and airflow before choosing a chassis.
Server directoryIdentify the enclosure, fabric modules and generation-specific interconnects.
Server configuratorSeparate shared power, node count and service access in the request.
Buying guidesSpecify rack height, bay size and backplane options.
Record CPU generation, socket count and DIMM population.
Include input power, PSU redundancy and remote-management needs.
A planning sequence, not a record of completed work.
Counts show records in the site catalog. They do not represent stock, available quantities or verified compatibility.
Snapshot: 2026-09-15
| Decision | Record in your brief | Evidence to retain |
|---|---|---|
| Chassis & drive layout | Specify rack height, bay size and backplane options. | Complete identifier and source revision |
| Processor & memory | Record CPU generation, socket count and DIMM population. | Platform document or written clarification |
| Power & management | Include input power, PSU redundancy and remote-management needs. | Offered-unit details and agreed scope |
Tick items as you prepare them. This is your personal checklist, not a hardware validation.
Saved in this browser when local storage is available.
Reference-based generated scenes; actual-unit photos are available only through an explicit unit-specific request. Related models are separate catalog records, not substitutes for the item on this page.
Continue the relevant directory or service flow.
Open resourceUse the connected tool to develop the requirement.
Open resourceRetain the supporting reference with your project brief.
Open resourceExact chassis model recorded · CPU and DIMM plan attached · Drive backplane and risers identified · Rails and power requirements listed.
