ASTER RACKIT — ITEM RFQ DRAFT
Not an offer, order, stock allocation or OEM-approved BOM.

Identifier: H223-S10-AAP1
Manufacturer: GIGABYTE
Record type: model
URL: https://www.aster-rackit.com/explore/product/gigabyte-h223-s10-aap1-51a818234b
Quantity: [enter]
Condition: [confirm]
Destination: [enter]

RECORDED TECHNICAL FIELDS — CHECK EVIDENCE STATUS
Dimensions (WxHxD, mm): 2U 3-Node - Front access 447.8 x 87.5 x 500 [unverified_inherited]
Motherboard: MS13-HD0 [unverified_inherited]
CPU: 5th Generation Intel® Xeon® Scalable processors 4th Generation Intel® Xeon® Scalable processors Intel® Xeon® CPU Max Series Single processor per node - With 1 x PCIe card per node at 35°C ambient, TDP up to 350 W - With 2 x PCIe cards per node at 30°C ambient, TDP up to 350 W - With 3 x PCIe cards per node at 35°C ambient, TDP up to 300 W - With 4 x PCIe cards per node at 30°C ambient, TDP up to 300 W [unverified_inherited]
Socket: 3 x LGA 4677 Socket E [unverified_inherited]
Chipset: Intel® C741 [unverified_inherited]
Memory: 24 x DIMM slots Support DDR5 RDIMM 8-Channel memory per processor 5th Gen Intel® Xeon®: Up to 5600 MT/s 4th Gen Intel® Xeon®: Up to 4800 MT/s Intel® Xeon® Max Series: Up to 4800 MT/s [unverified_inherited]
LAN: Front: 2 x CMC Management LAN [unverified_inherited]
Video: Integrated in ASPEED® AST2600 x 3 - 3 x Mini-DP [unverified_inherited]
Storage: Front hot-swap: 6 x 9.5mm E1.S Gen4 NVMe Internal M.2 (CFPH010 x 3): 3 x M.2 (2242/2260/2280/22110), SATA, from PCH [unverified_inherited]
SAS: N/A [unverified_inherited]
RAID: Onboard VROC key header [unverified_inherited]
PCIe Expansion Slots: Riser Card CRSH02D x 3: - 6 x FHHL x16 (Gen5 x16) Riser Card CRSH02E x 3: - 3 x LP x16 (Gen5 x16) - 3 x LP x16 (Gen5 x8) [unverified_inherited]
Front I/O: 2 x CMC ports 1 x CMC status LED I/O board - CFPH010 x 3: 3 x USB 3.2 Gen1 ports (Type-C) 3 x Mini-DP 3 x Power buttons with LED 3 x System status LEDs 3 x ID LEDs [unverified_inherited]
Rear I/O: N/A [unverified_inherited]
Backplane Board: Speed and bandwidth: PCIe Gen4 x4 [unverified_inherited]
Security Modules: 1 x TPM header with SPI interface - Optional TPM 2.0 kit: CTM010 [unverified_inherited]
Power supply: 1+1 3000 W 80 PLUS Titanium redundant power supplies [1] AC Input: - 100-127V~/ 15.5A, 50-60Hz - 200-220V~/ 15.5A, 50-60Hz - 220-240V~/ 15.5A, 50-60Hz DC Input: (Only for China) - 240Vdc/ 15.5A DC Output: - Max 1000W/ 100-127V~ +12.2V/ 81A +12Vsb/ 3A - Max 2600W/ 200-220V~ +12.2V/ 213A +12Vsb/ 3A - Max 3000W/ 220-240V~ or 240Vdc Input +12.2V/ 245A +12Vsb/ 3A [1] The system power supply requires C19 power cord. Power cords are not included. Specify suitable cords separately. [unverified_inherited]
System Management: ASPEED® AST2600 Baseboard Management Controller ASPEED® AST2520 Chassis Management Controller GIGABYTE Management Console web interface Dashboard HTML5 KVM Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.) Sensor Reading History Data FRU Information SEL Log in Linear Storage / Circular Storage Policy Hardware Inventory Fan Profile System Firewall Power Consumption Power Control Advanced power capping LDAP / AD / RADIUS Support Backup & Restore Configuration Remote BIOS/BMC/CPLD Update Event Log Filter User Management Media Redirection Settings PAM Order Settings SSL Settings SMTP Settings [unverified_inherited]
OS Certifications: Windows Server 2022 Windows Server 2025 [unverified_inherited]
System Fans: 4 x 80x80x38mm [unverified_inherited]
Operating Properties: Operating temperature: 10°C to 35°C Operating humidity: 8% to 80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20% to 95% (non-condensing) [unverified_inherited]
Weight: Net Weight: 17.2 kg Gross Weight: 27.38 kg [unverified_inherited]
Packaging Dimensions: 862 x 676 x 294 mm [unverified_inherited]
Packaging Content: 1 x H223-S10-AAP1 3 x CPU heatsinks 1 x Mini-DP to D-Sub cable 9 x CPU carriers 1 x L-shape Rail kit [unverified_inherited]

PURCHASE CHECKS
1. Name the chassis layout and front, middle and rear drive positions before selecting processors or storage.
2. Identify the installed backplane, risers, cables and controller. A list of maximum specifications is not one simultaneously available configuration.
3. Keep CPU quantity, memory population, accelerator power and cooling on the same bill of materials. Review the dependencies whenever one of them changes.
4. List rails, bezel, power leads, boot media, management functions and operating-system licenses separately. Do not assume they are included with a bare chassis.
5. For pre-owned equipment, request an actual-unit inventory and diagnostic record. Agree acceptance criteria before the unit is dispatched.

PHOTO / EVIDENCE REQUIREMENTS
Front and rear chassis
Actual service label, private data redacted
Internal topology when relevant
All included accessories
Actual diagnostic report

Confirm current exact identity, compatibility, stock, price, warranty and delivery terms with sales@aster-rackit.com.