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Server motherboardsGIGABYTE
MD72-HB2

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No unverified model image substituted.

model

MD72-HB2

GIGABYTE MD72-HB2 — Server motherboards

GIGABYTEServer motherboards20 technical fields
Form Factor (WxD, mm)
E-ATX 305 x 330
Processor Supported
3rd Generation Intel® Xeon® Scalable Processors Dual processor, TDP up to 270W
Socket
2 x LGA 4189 Socket P+
Chipset Description
Intel® C621A

Inherited technical record

Price and availability: Request quotation

Download editable RFQ checklist ↓

A technical record does not certify stock, condition, current orderability or a factory-approved BOM.

Identity & purchasing scope

Buyers evaluating server motherboards hardware start from the MD72-HB2 record before comparing condition and price. Top recorded values — form factor (wxd, mm) E-ATX 305 x 330, processor supported 3rd Generation Intel® Xeon® Scalable Processors Dual processor, TDP up to 270W, socket 2 x LGA 4189 Socket P+ — come from the supplied dataset with review labels. When the recorded fields match your requirement, add the MD72-HB2 to a quote and send it for confirmation.

This record identifies MD72-HB2 in the GIGABYTE server motherboards catalog. Its classification is model. Preserve the full identifier when comparing offers: suffixes, revisions and assembly contents are part of the purchasing question.

Prepare an ASTER RACKIT sourcing request for MD72-HB2. Record the exact part number, required quantity and destination system. Review the listed evidence and confirm the offered unit, accessories and compatibility before purchase. Use the technical record to prepare an inquiry rather than as evidence that an item is available, tested, licensed or covered by a particular warranty. Inherited fast-shipping and stock language is not carried into this catalog's commercial fields.

Recorded technical specifications

Each field states its evidence status. Inherited and title-derived values remain unverified; reviewed OEM facts do not certify an offered configuration.

FieldRecorded valueSource snapshot
Form Factor (WxD, mm)E-ATX 305 x 330model-products
unverified_inherited
Processor Supported3rd Generation Intel® Xeon® Scalable Processors Dual processor, TDP up to 270Wmodel-products
unverified_inherited
Socket2 x LGA 4189 Socket P+model-products
unverified_inherited
Chipset DescriptionIntel® C621Amodel-products
unverified_inherited
Memory Type16 x DIMM slots Support DDR4 RDIMM/LRDIMM 8-channel memory per processor Memory speed: 3200/2933/2666 MT/smodel-products
unverified_inherited
Integrated Network2 x 10Gb/s LAN (1 x Intel® X710-AT2) 2 x 1Gb/s LAN (2 x Intel® I210-AT) - Support NCSI function (by switch) 1 x 10/100/1000 Mbps Management LANmodel-products
unverified_inherited
Integrated Video ControllerIntegrated in ASPEED® AST2600 - 1 x VGA portmodel-products
unverified_inherited
Integrated Audio ControllerN/Amodel-products
unverified_inherited
Storage InterfaceSlimSAS: 3 x SlimSAS 4i for 12 x SATA, from PCH SATA 7-pin: 2 x SATA, from PCH M.2: 2 x M.2 (2280/22110), PCIe Gen4 x4, from CPU_0model-products
unverified_inherited
Support RAID FunctionIntel® SATA RAID 0/1/10/5 Onboard VROC key headermodel-products
unverified_inherited
PCIe Expansion SlotsSlot_6: PCIe x16 (Gen4 x16), from CPU_0 Slot_5: PCIe x16 (Gen4 x16), from CPU_1 Slot_4: PCIe x16 (Gen4 x16), from CPU_1 Slot_3: PCIe x16 (Gen4 x16), from CPU_0 Slot_2: PCIe x16 (Gen4 x16), from CPU_0 Slot_1: PCIe x16 (Gen4 x16), from CPU_1model-products
unverified_inherited
On-Board Connector1 x 24-pin ATX main power connector 2 x 8-pin ATX 12V power connectors 1 x 6-pin ATX 12V power connector for PCIe slots 2 x CPU fan headers 5 x System fan headers 1 x USB 3.2 Gen1 x2 header 2 x M.2 slots 3 x SlimSAS 4i connectors 2 x SATA 7-pin connectors 1 x VROC connector 1 x Front panel header 1 x Backplane board header 1 x PMBus header 1 x IPMB header 1 x TPM headermodel-products
unverified_inherited
Rear I/O Connectors2 x USB 3.2 Gen1 ports (Type-A) 1 x VGA port 1 x RJ45 serial port 4 x RJ45 ports 1 x MLAN port 1 x ID button with LEDmodel-products
unverified_inherited
Security Modules1 x TPM header with SPI interface - Optional TPM2.0 kit: CTM010model-products
unverified_inherited
OS Driver SupportedWindows Server 2016 Windows Server 2019 Windows Server 2022 Red Hat Enterprise Linux 7.9 or later Red Hat Enterprise Linux 8.2 or later Red Hat Enterprise Linux 9.0 or later SUSE Linux Enterprise Server 12 SP5 or later SUSE Linux Enterprise Server 15 SP2 or later Ubuntu 20.04 LTS or later Ubuntu 22.04 LTS or later VMware ESXi 6.7 Update3 P03 or later VMware ESXi 7.0 Update2 or later VMware ESXi 8.0 or later Citrix Hypervisor 8.2.0 or later OS certifications: Windows Server 2019 Windows Server 2022model-products
unverified_inherited
Server ManagementASPEED® AST2600 Baseboard Management Controller GIGABYTE Management Console web interface Dashboard HTML5 KVM Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.) Sensor Reading History Data FRU Information SEL Log in Linear Storage / Circular Storage Policy Hardware Inventory Fan Profile System Firewall Power Consumption Power Control Advanced power capping LDAP / AD / RADIUS Support Backup & Restore Configuration Remote BIOS/BMC/CPLD Update Event Log Filter User Management Media Redirection Settings PAM Order Settings SSL Settings SMTP Settingsmodel-products
unverified_inherited
PSU Connector1 x 24-pin ATX main power connector 2 x 8-pin ATX 12V power connectors 1 x 6-pin ATX 12V power connector for PCIe slotsmodel-products
unverified_inherited
Operating PropertiesOperating temperature: 10°C to 40°C Operating humidity: 8% to 80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20% to 95% (non-condensing)model-products
unverified_inherited
Packaging Bundle1 x MD72-HB2 1 x I/O shield 1 x Quick start guide 1 x SlimSAS 4i to 4 x SATA cable (600mm) Single Box dimensions: 409 x 355 x 78 mm Carton dimensions: 729 x 415 x 432 mm Quantity: 10 x single boxes in one cartonmodel-products
unverified_inherited
Bulk Packaging Content10 x MD72-HB2 10 x I/O shields Carton dimensions: 600 x 473 x 495 mmmodel-products
unverified_inherited

Configuration & purchase checks

  1. Keep the complete board model and revision, including any OEM-specific identifier.
  2. Review supported processors, firmware and memory for the exact board revision.
  3. Check mounting, power connectors, front-panel cabling and cooling before a board transplant.
  4. Record whether carriers, heatsink mounts, I/O shields and management functions are included.
  5. Request socket and connector photographs and an agreed functional-test scope.

Adding an item prepares a local RFQ line. It does not create a price offer, reserve inventory or submit an order.

Read the category procurement guide →

Typical deployment contexts

Common project contexts where buyers request this server motherboards. Contexts inform the inquiry — they are not compatibility claims.

01

Server board repair and refresh

02

System integration builds

03

Spare board stocking

Frequently asked questions

What is the MD72-HB2?

The MD72-HB2 is a recorded GIGABYTE server motherboards identity (model). Recorded highlights: Form Factor (WxD, mm) E-ATX 305 x 330; Processor Supported 3rd Generation Intel® Xeon® Scalable Processors Dual processor, TDP up to 270W.

Are the specifications on this page verified?

The record carries 20 technical fields, each with an evidence label. Reviewed fields come from OEM catalog evidence; unverified fields stay visibly marked and should be confirmed before purchase.

How do I get a price for the MD72-HB2?

Add the record to the quote basket and send the inquiry — ASTER RACKIT confirms price, condition and availability in a written quotation.

Does an image on this page show the actual offered unit?

No. Images are reference material only. Request exact-unit photography with serial numbers before committing to an order.

Platform relationships & upgrade review

No explicit target-platform relationship is provided for this record. Brand, socket, capacity and visual resemblance alone must not be used to invent a compatibility claim.

Related records below are category neighbors. They are not approved replacement parts.

Actual-unit evidence to request

01

Board overview

02

Board ID and revision

03

Socket condition

04

Power connectors

05

Included accessories

No server boot-screen image is attached to this record. Request product photographs and any diagnostic or entitlement record as separate evidence.

Facility reference scenes from our warehouse and test benches. They show the environment and handling standard for this equipment family — they are not photographs of the exact offered unit.

At acceptance, compare the delivered unit, labels and accessories with the approved list. Retain source revisions and receiving records for later maintenance.

Source trace & documentation

Source fileSource recordEvidence status
lib/model-products.jsongigabyte-model-md72-hb2Inherited snapshot; not re-certified

A product-specific OEM URL was not included in the source mapping. Obtain the current document and revision before order approval.

How evidence quality is classified →

Frequently asked questions

Is the item currently available?

This is not a live stock feed. Confirm full identifier, condition, quantity, price and delivery scope in a written quotation.

Does this record certify compatibility?

No. Inherited fields and platform associations require review against the exact destination system and current manufacturer documentation.

What should I send in an RFQ?

Include the full identifier, quantity, destination, target platform, condition, accessories and evidence needed for acceptance.

Is a configuration number another server model?

No. Models, ordering configurations, options and reference labels are distinct record types. Ask which actual purchasing unit will be supplied.

Related category records

Browse category →
GIGABYTEmodel
MD72-HB3

GIGABYTE MD72-HB3 — Server motherboards

Form Factor (WxD, mm)
E-ATX 305 x 330
Processor Supported
3rd Generation Intel® Xeon® Scalable Processors Dual processor, TDP up to 270W
Socket
2 x LGA 4189 Socket P+

Inherited technical record

View details →
GIGABYTEmodel
MP72-HB0

GIGABYTE MP72-HB0 — Server motherboards

Form Factor (WxD, mm)
E-ATX 305 x 330
Processor Supported
Ampere® Altra® Processors Ampere® Altra® Max Processors Dual processor, TDP 250W [Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 4926

Inherited technical record

View details →
GIGABYTEmodel
MU72-SU0

GIGABYTE MU72-SU0 — Server motherboards

Form Factor (WxD, mm)
ATX 304.8 x 244
Processor Supported
3rd Generation Intel® Xeon® Scalable Processors Intel® Xeon® W-3300 Processors Single processor, TDP up to 270W
Socket
1 x LGA 4189 Socket P+

Inherited technical record

View details →
GIGABYTEmodel
MU92-TU1

GIGABYTE MU92-TU1 — Server motherboards

Form Factor (WxD, mm)
E-ATX 305 x 330
Processor Supported
3rd Generation Intel® Xeon® Scalable Processors Intel® Xeon® W-3300 Processor Single processor, TDP up to 270W
Socket
1 x LGA 4189 Socket P+

Inherited technical record

View details →
GIGABYTEmodel
MB12-CE0

GIGABYTE MB12-CE0 — Server motherboards

Form Factor (WxD, mm)
Mini-ITX 170 x 170
Processor Supported
Intel® Xeon® D-1700 processors Default CPU: Intel® Xeon® D-1739 Single processor, TDP 83W
Socket
FCBGA 2227

Inherited technical record

View details →
GIGABYTEmodel
MA34-CP0

GIGABYTE MA34-CP0 — Server motherboards

Board format and dimensions (W × D, mm)
E-ATX 304.8 x 335.2
Processor sockets
1 x LGA 7529 Socket BR
Chipset
System on Chip

Inherited technical record

View details →
01

Components & OEM kits — the next decisions

GIGABYTE / Components & OEM kits

MD72-HB2

A spare, assembly and option number may identify different contents.

This guide adds the decisions, documents and next steps that support this page.

Parts directory
Components & OEM kits illustrative environment
02

Choose the right route

Core components

Identify CPU, memory and storage by the complete manufacturer PN.

Parts directory

Expansion parts

Check slot, interface, bracket and supported firmware.

PN workbench
03

Details that change the configuration

Assembly identity

A spare, assembly and option number may identify different contents.

Target platform

Name the chassis generation and installed configuration.

Replacement scope

State whether the request is an exact replacement or a proposed alternative.

04

From requirement to handover

  1. 01

    Read component label

  2. 02

    Record host platform

  3. 03

    Define kit contents

  4. 04

    Review replacement fit

A planning sequence, not a record of completed work.

05

Explore the relevant catalog

GIGABYTE

Recorded catalog identities

Counts show records in the site catalog. They do not represent stock, available quantities or verified compatibility.

Snapshot: 2026-09-15

06

Compare the buying requirements

Components & OEM kits comparison brief
DecisionRecord in your briefEvidence to retain
Assembly identityA spare, assembly and option number may identify different contents.Complete identifier and source revision
Target platformName the chassis generation and installed configuration.Platform document or written clarification
Replacement scopeState whether the request is an exact replacement or a proposed alternative.Offered-unit details and agreed scope
Open the comparison workspace
07

Build your readiness checklist

Your preparation progress

Tick items as you prepare them. This is your personal checklist, not a hardware validation.

0 / 4 prepared0

Saved in this browser when local storage is available.

08

A closer look at the hardware

MD72-HB2 — Rack Cabling Closeup facility reference
Rack Cabling Closeup Explore
MD72-HB2 — Server Internals Open facility reference
Server Internals Open Explore
MD72-HB2 — Export Crate Packing facility reference
Export Crate Packing Explore
1 / 3

Reference-based generated scenes; actual-unit photos are available only through an explicit unit-specific request. Related models are separate catalog records, not substitutes for the item on this page.

09

Keep the supporting material together

Component photo collection

Retain the supporting reference with your project brief.

Open resource
10

Turn the brief into the next step

GIGABYTE / Components & OEM kits

Keep the requirement specific.

Full manufacturer PN captured · OEM kit content list supplied · Target chassis and revision recorded · Alternative-part approval required.