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GIGABYTE H174-A80-LAS1 — Rack & blade servers
Inherited technical record
Price and availability: Request quotation
Download editable RFQ checklist ↓A technical record does not certify stock, condition, current orderability or a factory-approved BOM.
Buyers evaluating rack & blade servers hardware start from the H174-A80-LAS1 record before comparing condition and price. Top recorded values — dimensions (wxhxd, mm) 1U 2-Node - Rear access 440 x 43.4 x 856, motherboard MA84-HD0, cpu Intel® Xeon® 6+ Processors - Intel® Xeon® 6900E+ Processors Intel® Xeon® 6 Processors - Intel® Xeon® 6900-Series Processors [DLC] Dual processors per node, TDP up to 500 W [Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable. — come from the supplied dataset with review labels. When the recorded fields match your requirement, add the H174-A80-LAS1 to a quote and send it for confirmation.
This record identifies H174-A80-LAS1 in the GIGABYTE rack & blade servers catalog. Its classification is model. Preserve the full identifier when comparing offers: suffixes, revisions and assembly contents are part of the purchasing question.
Prepare an ASTER RACKIT sourcing request for H174-A80-LAS1. Record the exact part number, required quantity and destination system. Review the listed evidence and confirm the offered unit, accessories and compatibility before purchase. Use the technical record to prepare an inquiry rather than as evidence that an item is available, tested, licensed or covered by a particular warranty. Inherited fast-shipping and stock language is not carried into this catalog's commercial fields.
Each field states its evidence status. Inherited and title-derived values remain unverified; reviewed OEM facts do not certify an offered configuration.
| Field | Recorded value | Source snapshot |
|---|---|---|
| Dimensions (WxHxD, mm) | 1U 2-Node - Rear access 440 x 43.4 x 856 | model-products unverified_inherited |
| Motherboard | MA84-HD0 | model-products unverified_inherited |
| CPU | Intel® Xeon® 6+ Processors - Intel® Xeon® 6900E+ Processors Intel® Xeon® 6 Processors - Intel® Xeon® 6900-Series Processors [DLC] Dual processors per node, TDP up to 500 W [Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable. | model-products unverified_inherited |
| Socket | 4 x LGA 7529 Socket BR | model-products unverified_inherited |
| Chipset | System on Chip | model-products unverified_inherited |
| Memory | 48 x DIMM slots Support DDR5 RDIMM/MRDIMM [1] 12-Channel memory per processor Intel Xeon 6900E+: RDIMM: Up to 8000 MT/s Intel Xeon 6900-series: RDIMM: Up to 6400 MT/s MRDIMM: Up to 8800 MT/s [1] MRDIMMs are supported only on select Intel® Xeon® 6 processors with P-cores. | model-products unverified_inherited |
| LAN | Rear (I/O board x 2): 4 x 1 Gb/s LAN (2 x Intel® I350-AM2) - Support NCSI function 2 x 10/100/1000 Mb/s Management LAN [1] [1] Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology. | model-products unverified_inherited |
| Video | Integrated in ASPEED® AST2600 x 2 - 2 x Mini-DP | model-products unverified_inherited |
| Storage | Front hot-swap: 4 x 2.5" Gen5 NVMe/SATA/SAS-4 [1] - (NVMe from CPU_1) [1] Optional cables and additional SAS cards are required to enable SATA and SAS drives. | model-products unverified_inherited |
| PCIe Expansion Slots | 2 x LP x16 (Gen5 x16), from CPU_0 2 x LP x16 (Gen5 x16), from CPU_0 [1] [1] Enabling the slots requires specific cold plate loops and tubes relocation. Confirm the required cooling-loop arrangement before enabling these slots. | model-products unverified_inherited |
| Front I/O | 2 x MLAN ports 2 x Power buttons with LED 2 x ID buttons with LED 2 x Reset buttons 2 x System status LEDs 1 x CMC status LED | model-products unverified_inherited |
| Rear I/O | I/O board x 2: 4 x USB 3.2 Gen1 ports (Type-A) 2 x Mini-DP 4 x RJ45 ports 2 x MLAN ports 2 x ID buttons with LED 2 x System status LEDs | model-products unverified_inherited |
| Security Modules | 2 x TPM headers with SPI interface - Optional TPM 2.0 kit: CTM012 2 x PRoT connectors (only enabled on RoT SKU) | model-products unverified_inherited |
| Power supply | 1+1 3200 W 80 PLUS Titanium redundant power supplies [1] AC Input: - 100-127V~/ 16A, 50-60Hz - 200-220V~/ 16A, 50-60Hz - 220-240V~/ 16A, 50-60Hz DC Input: (Only for China) - 240Vdc/ 16A DC Output: - Max 1300W/ 100-127V~ +12.2V/ 106.6A +12.2Vsb/ 3A - Max 3000W/ 200-220V~ +12.2V/ 246A +12.2Vsb/ 3A - Max 3200W/ 220-240V~ or 240Vdc Input +12.2V/ 262.3A +12.2Vsb/ 3A [1] The system power supply requires C19 power cord. Power cords are not included. Specify suitable cords separately. | model-products unverified_inherited |
| System Fans | 6 x 40x40x28mm | model-products unverified_inherited |
| Operating Properties | Operating temperature: 10°C to 30°C Operating humidity: 8% to 80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20% to 95% (non-condensing) [Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 45°C. | model-products unverified_inherited |
| Packaging Dimensions | 1187 x 733 x 281 mm | model-products unverified_inherited |
| Packaging Content | 1 x H174-A80-LAS1 2 x CPU cold plate loops 1 x Mini-DP to D-Sub cable 4 x Carriers 1 x 3-Section Rail kit | model-products unverified_inherited |
Adding an item prepares a local RFQ line. It does not create a price offer, reserve inventory or submit an order.
Read the category procurement guide →Common project contexts where buyers request this rack & blade servers. Contexts inform the inquiry — they are not compatibility claims.
The H174-A80-LAS1 is a recorded GIGABYTE rack & blade servers identity (model). Recorded highlights: Dimensions (WxHxD, mm) 1U 2-Node - Rear access 440 x 43.4 x 856; Motherboard MA84-HD0.
The record carries 18 technical fields, each with an evidence label. Reviewed fields come from OEM catalog evidence; unverified fields stay visibly marked and should be confirmed before purchase.
Add the record to the quote basket and send the inquiry — ASTER RACKIT confirms price, condition and availability in a written quotation.
No. Images are reference material only. Request exact-unit photography with serial numbers before committing to an order.
No explicit target-platform relationship is provided for this record. Brand, socket, capacity and visual resemblance alone must not be used to invent a compatibility claim.
Related records below are category neighbors. They are not approved replacement parts.
No server boot-screen image is attached to this record. Request product photographs and any diagnostic or entitlement record as separate evidence.
Facility reference scenes from our warehouse and test benches. They show the environment and handling standard for this equipment family — they are not photographs of the exact offered unit.
At acceptance, compare the delivered unit, labels and accessories with the approved list. Retain source revisions and receiving records for later maintenance.
| Source file | Source record | Evidence status |
|---|---|---|
| lib/model-products.json | gigabyte-model-h174-a80-las1 | Inherited snapshot; not re-certified |
A product-specific OEM URL was not included in the source mapping. Obtain the current document and revision before order approval.
How evidence quality is classified →This is not a live stock feed. Confirm full identifier, condition, quantity, price and delivery scope in a written quotation.
No. Inherited fields and platform associations require review against the exact destination system and current manufacturer documentation.
Include the full identifier, quantity, destination, target platform, condition, accessories and evidence needed for acceptance.
No. Models, ordering configurations, options and reference labels are distinct record types. Ask which actual purchasing unit will be supplied.
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Specify rack height, bay size and backplane options.
This guide adds the decisions, documents and next steps that support this page.
Server directory
Plan rack depth, rail kit and airflow before choosing a chassis.
Server directoryIdentify the enclosure, fabric modules and generation-specific interconnects.
Server configuratorSeparate shared power, node count and service access in the request.
Buying guidesSpecify rack height, bay size and backplane options.
Record CPU generation, socket count and DIMM population.
Include input power, PSU redundancy and remote-management needs.
A planning sequence, not a record of completed work.
Counts show records in the site catalog. They do not represent stock, available quantities or verified compatibility.
Snapshot: 2026-09-15
| Decision | Record in your brief | Evidence to retain |
|---|---|---|
| Chassis & drive layout | Specify rack height, bay size and backplane options. | Complete identifier and source revision |
| Processor & memory | Record CPU generation, socket count and DIMM population. | Platform document or written clarification |
| Power & management | Include input power, PSU redundancy and remote-management needs. | Offered-unit details and agreed scope |
Tick items as you prepare them. This is your personal checklist, not a hardware validation.
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Reference-based generated scenes; actual-unit photos are available only through an explicit unit-specific request. Related models are separate catalog records, not substitutes for the item on this page.
Continue the relevant directory or service flow.
Open resourceUse the connected tool to develop the requirement.
Open resourceRetain the supporting reference with your project brief.
Open resourceExact chassis model recorded · CPU and DIMM plan attached · Drive backplane and risers identified · Rails and power requirements listed.
