What ships with the model?
Identify processors, DIMMs, drives, carriers, adapters, controllers, fans, power supplies, risers, rails and cables separately. A supported option is not necessarily installed or included.
Server systems
GIGABYTE H270-T70
2U 4 Nodes High Density Rack Server
Choose the system revision
Parameters and parts below apply only to the selected revision. Check the equipment label before choosing; other revisions need separate confirmation.
Legacy revision · software updates supported. Confirm the required software release, service arrangements and equipment availability before ordering.
Product specifications
Model details for your requirement.
- Manufacturer
- GIGABYTE
- Model
- H270-T70
- Product type
- Server systems
- Revision
- 110
- Dimensions (WxHxD, mm)
- 2U 447 x 87.2 x 780 (mm)
- Motherboard
- MT70-HD0
- CPU
- Per node: 2 x Cavium® ThunderX™ ARM processors 64bit ARMv8 architecture 48 cores per processor, 2.0GHz BGA 2601, 28nm technology Total: 8 x Cavium® ThunderX™ ARM processors Total 384 cores
- Chipset
- -
- Memory
- Per node: 16 x DIMM slots DDR4 memory supported only Quad channel memory architecture Up to total 512GB memory capacity 1866 MHz with 2DPC for Single Rank or Dual Rank RDIMMs / ECC UDIMMs 2133 MHz with 1DPC for Single Rank or Dual Rank RDIMMs / ECC UDIMMs NOTE: Due to processor specification, at least 4 x DIMM modules must be installed for one node Total: 64 x DIMM slots Up to total 2TB memory capacity
- LAN
- Per node: 2 x 40GbE QSFP+ LAN ports 1 x 10/100/1000 management LAN port Total: 8 x 40GbE QSFP+ LAN ports 4 x 10/100/1000 management LAN ports
- Video
- Integrated in Aspeed® AST2400 2D Video Graphic Adapter with PCIe bus interface 1920x1200@60Hz 32bpp
- Audio
- -
- Storage
- Per node: 4 x 2.5" hot-swappable HDD/SSD bays Total: 16 x 2.5" hot-swappable HDD/SSD bays - NOTE: GIGABYTE recommends that you follow the QVL when selecting hard drives, to avoid any system compatibility issues
- SAS
- -
- RAID
- Depends on OS RAID
- Peripheral Drives
- -
- Expansion Slots
- Per node: 1 x Half-length low-profile slot with PCIe x16 (Gen3 x8 bus) connector 1 x Mezzanine PCIe x8 (Gen3 x8 bus) connector Total: 4 x Half-length low-profile slots with PCIe x16 (Gen3 x8 bus) connectors 4 x Mezzanine PCIe x8 (Gen3 x8 bus) connectors
- Internal I/O
- Per node: 2 x 18-pin power connectors 4 x SATA III 6Gb/s ports (1 with SATA DOM supported) 1 x SATA SGPIO header 1 x SATA DOM header 1 x USB 3.0 header 1 x COM2 header 1 x Case open connector 1 x PMBUS connector 1 x Clear CMOS header 1 x IPMB connector
- Front I/O
- Per node: 2 x USB 3.0 1 x VGA 1 x Power button with LED 1 x ID button with LED Total: 8 x USB 3.0 4 x VGA 4 x Power buttons with LED 4 x ID buttons with LED
- Rear I/O
- Per node: 2 x USB 3.0 1 x VGA 1 x COM1 2 x QSFP+ 1 x RJ45 1 x Power button with LED 1 x ID button with LED 1 x System reset button 1 x System status LED 2 x LAN activity LEDs 2 x LAN link status LEDs Total: 8 x USB 3.0 4 x VGA 4 x COM1 8 x QSFP+ 4 x RJ45 4 x Power button with LED 4 x ID button with LED 4 x System reset button 4 x System status LED 8 x LAN activity LEDs 8 x LAN link status LEDs
- Backplane Board
- Speed and bandwidth: SATA 6Gb/s
- TPM
- -
- Power supply
- 2 x 1600W redundant PSU 80 PLUS Platinum 100~230V AC Power cords are not included. Specify suitable cords separately.
- System Management
- Aspeed® AST2400 management controller Avocent® MergePoint IPMI 2.0 web interface: Network settings Network security settings Users control Services settings IPMI settings Sessions control LDAP settings Power control Voltages, fans and temperatures monitoring System event log Events management (platform events, trap settings, email settings) Serial Over LAN vKVM & vMedia (launch, configuration)
- OS Compatibility
- Certified OS Ubuntu 16.04.1 64bit SLES12 SP2 Compatible OS openSUSE Tumbleweed openSUSE Leap 42.1+ RHEL 7.3 64bit CentOS 7.3 64bit
- System Fans
- 16 x 40x40x56mm (23’000rpm)
- Operating Properties
- Operating temperature: 10°C to 35°C Operating humidity: 8-80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20%-95% (non-condensing)
- Weight
- 38kg
- Packaging Dimensions
- 1133 x 724 x 261 (mm)
- Packaging Content
- - 1 x H270-T70 system - 1 x Quick Installation Guide - Rail kit
- Ordering options and packaging
- Rackmount: 6NH270T70MR-00
Configuration options and limits depend on the exact product and revision. Confirm the proposed combination and the supplied parts before ordering; optional features are not necessarily included.
- Confirm the supplied revision and complete configuration before ordering. Supported options are not necessarily included.
- Specifications apply to revision 110. Other revisions require separate confirmation.
- Interface speeds and advertised limits are theoretical maxima. Actual performance depends on the installed configuration.
- Confirm the included hardware and accessories for the specific offer.
Replacement parts & service options
Find the right part for H270-T70.
System revision: 110
Select the GIGABYTE part numbers you need and add quantities to your enquiry. Confirm the exact chassis revision, installed components and kit contents before ordering. These options are not a complete system configuration.
3 of 3 parts shown
| Select | GIGABYTE P/N | Part description | Quantity |
|---|---|---|---|
| 9MT70HD0NR-00 | Motherboard | ||
| 25EP0-216004-D0S | Power supply | ||
| 25HB2-A86100-K0R | Rail Kit |
0 part numbers selected
Availability, condition and supplied items will be confirmed in your quotation.
Installation & configuration
Define the complete system, not just the chassis.
- Processor and memory
- Specify the intended workload, processor quantity, memory capacity and any existing parts to retain. Ask for a compatible processor and DIMM population for the exact system revision.
- Storage layout
- List the required drive type, capacity and bay arrangement. Confirm carriers, backplanes, RAID or HBA controllers and the complete cable set.
- Expansion and cooling
- Describe GPU and network requirements. Confirm the required risers, slot access, power connections and cooling provisions for the proposed build.
- Rack and site requirements
- Share available rack space, rack depth, power input and redundancy requirements. Agree on rails, regional power cords and the installation environment.
Included hardware
Make the offer clear, line by line.
Ordering and delivery details
Confirm the exact ordering PN, revision, quantity, condition and warranty terms. Agree on packing, destination, lead time and any substitutions before approving the purchase.
Photographs & inspection
Review the actual offered equipment.
Request unit-label photographs, startup information and an installed-component list. Agree on the test scope and records needed for the quoted configuration.
Test workshop and visitsFor multi-unit purchases, agree on whether a matched model, revision or configuration is required. Ask for any exceptions to be identified and approved before packing.
Packing and order preparationYour model enquiry
Questions to settle before purchase.
Is this model name the ordering part number?
Not necessarily. Ask for the complete ordering PN or SKU and the supplied configuration on the quotation. This model page does not assign an unconfirmed sales code.
Can I use this with my existing equipment?
Provide the exact installed model, revision, firmware and relevant component labels. Compatibility must be confirmed for that combination rather than inferred from a matching brand or connector.
Are the listed limits available together?
Not necessarily. Maximum memory, expansion, storage and power specifications may have different configuration requirements. Ask for review of the complete proposed build.
Does preparing an enquiry send it to sales?
No. The enquiry page prepares a draft on your device. Review it and share it with your sales contact or use the Contact Us page.
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These are separate products, not automatic replacements or compatible accessories.
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Specifications & enquiriesPHOTOGRAPHS THAT SUPPORT YOUR RFQ
Specify the supplied chassis, not just the model name.
Attach a photo brief to the request for GIGABYTE H270-T70. This is a checklist to agree, not a record that inspection has already been performed.
Front and storage layout
Request a straight-on view with the bezel removed when appropriate. Record the populated bays, blanking panels and drive carriers against the offered chassis configuration.
Rear and included options
Ask for both PSU labels, risers, network adapters and the rail kit. Confirm which visible parts are included in the offer rather than assuming the catalog picture defines the BOM.
Separate diagnostic evidence
Use an order-specific report for installed CPUs, DIMMs, storage and management access. A blurred background screen in an illustration is not a diagnostic result.
Discuss your requirements
Discuss GIGABYTE H270-T70.
Add quantity, desired configuration, condition and destination to a model-specific enquiry. Confirm the ordering code and final equipment list with your sales contact.
