GIGABYTE H263-V60-LAW1

Manufacturer

GIGABYTE

Model

H263-V60-LAW1

Product type

Server systems

Dimensions (WxHxD, mm)

2U 4-Node - Rear access 440 x 87.5 x 850

Motherboard

MV63-HD0

Superchip

Per node: NVIDIA Grace™ CPU Superchip: - 2 x NVIDIA Grace™ CPUs - Connected with NVIDIA NVLink™-C2C - TDP up to 500W (CPU + memory)

Memory

Per node: 480GB of LPDDR5X memory with ECC [1] Memory bandwidth up to 1TB/s [1] [1] Modules with 960GB of CPU memory and 768GB/s memory bandwidth are also available. Confirm this configuration before ordering.

LAN

Rear: 4 x 10/100/1000 Mbps Management LAN 1 x CMC Management LAN

Video

Integrated in ASPEED® AST2600 x 4 - 4 x VGA ports

Storage

Front hot-swap: 16 x 2.5" Gen5 NVMe - (8 x NVMe from CPU_0, 8 x NVMe from CPU_1) Internal M.2: 8 x M.2 (2280/22110), PCIe Gen5 x4, from CPU_1

SAS

N/A

RAID

N/A

PCIe Expansion Slots

PCIe Cable x 4: - 4 x FHHL x16 (Gen5 x16), from CPU_1 4 x OCP NIC 3.0 (Gen5 x16), from CPU_0 - Support NCSI function

Front I/O

4 x Power buttons with LED 4 x ID buttons with LED 4 x Reset buttons 4 x System status LEDs 1 x CMC status LED 1 x CMC reset button

Rear I/O

8 x USB 3.2 Gen1 ports (Type-A) 4 x VGA ports 4 x MLAN ports 4 x ID buttons with LED 1 x CMC port

Backplane Board

Speed and bandwidth: PCIe Gen5 x4

Security Modules

1 x TPM header with SPI interface - Optional TPM2.0 kit: CTM012

Power supply

2+1 3000W 80 PLUS Titanium redundant power supplies [1] AC Input: - 100-127V~/ 16A, 50/60Hz - 200-207V~/ 16A, 50/60Hz - 208-240V~/ 16A, 50/60Hz DC Input: (Only for China) - 240Vdc/ 16A DC Output: - Max 1200W/ 100-127V~ +12.2V/ 98.36A +12.2Vsb/ 3A - Max 2600W/ 200-207V~ +12.2V/ 213A +12.2Vsb/ 3A - Max 3000W/ 208-240V~ or 240Vdc Input +12.2V/ 245.9A +12.2Vsb/ 3A [1] The system power supply requires C19 power cord. Power cords are not included. Specify suitable cords separately.

System Management

ASPEED® AST2600 Baseboard Management Controller ASPEED® AST2520 Chassis Management Controller GIGABYTE Management Console web interface Dashboard HTML5 KVM Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.) Sensor Reading History Data FRU Information SEL Log in Linear Storage / Circular Storage Policy Hardware Inventory Fan Profile System Firewall Power Consumption Power Control Advanced power capping LDAP / AD / RADIUS Support Backup & Restore Configuration Remote BIOS/BMC/CPLD Update Event Log Filter User Management Media Redirection Settings PAM Order Settings SSL Settings SMTP Settings

System Fans

4 x 80x80x80mm

Operating Properties

Operating temperature: 10°C to 35°C Operating humidity: 10% to 80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20% to 90% (non-condensing) [Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 45°C.

Weight

Net Weight: 49.37 kg Gross Weight: 54.37 kg

Packaging Dimensions

1181 x 715 x 336 mm

Packaging Content

1 x H263-V60-LAW1 4 x Superchip cold plate loops 1 x 3-Section Rail kit

Configuration options and limits depend on the exact product and revision. Confirm the proposed combination and the supplied parts before ordering; optional features are not necessarily included.

• Confirm the supplied revision and complete configuration before ordering. Supported options are not necessarily included.
• Interface speeds and advertised limits are theoretical maxima. Actual performance depends on the installed configuration.
• Confirm the ordering option, package quantity and included items for the specific offer. Packaging options are not interchangeable without confirmation.

Processor and memory

Specify the intended workload, processor quantity, memory capacity and any existing parts to retain. Ask for a compatible processor and DIMM population for the exact system revision.

Storage layout

List the required drive type, capacity and bay arrangement. Confirm carriers, backplanes, RAID or HBA controllers and the complete cable set.

Expansion and cooling

Describe GPU and network requirements. Confirm the required risers, slot access, power connections and cooling provisions for the proposed build.

Rack and site requirements

Share available rack space, rack depth, power input and redundancy requirements. Agree on rails, regional power cords and the installation environment.