GIGABYTE H262-PC2

Manufacturer

GIGABYTE

Model

H262-PC2

Product type

Server systems

Revision

100

Dimensions (WxHxD, mm)

2U 4-Node - Rear access 440 x 87.5 x 840

Motherboard

MH62-HD2

CPU

3rd Generation Intel® Xeon® Scalable Processors Dual processor per node, 10nm technology CPU TDP up to 270W Please leave one PCIe slot empty if using processor with 270W TDP NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable

Socket

Per Node: 2 x LGA 4189 Total: 8 x LGA 4189 Socket P+

Chipset

Intel® C621A Chipset

Memory

Per node: 16 x DIMM slots Total: 64 x DIMM slots DDR4 memory supported only 8-channel memory architecture RDIMM modules up to 128GB supported LRDIMM modules up to 128GB supported 3DS RDIMM/LRDIMM modules up to 256GB supported 1.2V modules: 3200/2933/2666 MHz

LAN

Per node: 1 x Dedicated management port Total: 4 x Dedicated management ports 1 x CMC port

Video

Integrated in Aspeed® AST2600 2D Video Graphic Adapter with PCIe bus interface 1920x1200@60Hz 32bpp, DDR4 SDRAM Management chip on CMC board: Integrated in Aspeed® AST2520A2-GP

Storage

Per node: 2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1 Total: 8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1 SAS card is required for SAS devices support

SAS

Depends on SAS add-on card

RAID

Intel® SATA RAID 0/1

Expansion Slots

Per node: Riser Card CRSH01H: - 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0 Riser Card CRSH01E: - 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0 1 x OCP 3.0 slot with PCIe Gen4 x16 bandwidth, from CPU_0 Total: Riser Card CRSH01H x 4: - 4 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0 Riser Card CRSH01E x 4: - 4 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0 4 x OCP 3.0 slots with PCIe Gen4 x16 bandwidth, from CPU_0

Internal I/O

Per node: 1 x COM header 1 x TPM header 1 x VROC connector 1 x BMC SGPIO header 1 x JTAG BMC header 1 x PLD header 1 x Clear CMOS jumper 1 x IPMB connector

Front I/O

Per node: 1 x Power button with LED 1 x ID button with LED 1 x Status LED 1 x Reset button Total: 4 x Power buttons with LED 4 x ID buttons with LED 4 x Status LEDs 4 x Reset buttons *1 x CMC Status LED *1 x CMC Reset button *Only one CMC Status LED and Reset button per system

Rear I/O

Per node: 2 x USB 3.0 1 x VGA 1 x MLAN 1 x ID LED Total: 8 x USB 3.0 4 x VGA 4 x MLAN 4 x ID LEDs *1 x CMC port *Only one CMC port per system

Backplane Board

Speed and bandwidth: PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s

TPM

1 x TPM header with SPI interface Optional TPM2.0 kit: CTM010

Power supply

Dual 2200W 80 PLUS Platinum redundant power supply AC Input: - 100-127V~/ 14A, 47-63Hz - 200-240V~/ 12.6A, 47-63Hz DC Input: - 240Vdc/ 12.6A DC Output: - Max 1200W/ 100-127V~ + 12.12V/ 95.6A + 12Vsb/ 3.5A - Max 2200W/ 200-240V~ + 12.12V/ 178.1A + 12Vsb/ 3.5A NOTE: The system power supply requires C19 power cord Power cords are not included. Specify suitable cords separately.

System Management

Aspeed® AST2600 management controller AMI MegaRAC SP-X Solution Web interface Dashboard HTML5 KVM Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.) Sensor Reading History Data FRU Information SEL Log in Linear Storage / Circular Storage Policy Hardware Inventory Fan Profile System Firewall Power Consumption Power Control Advanced power capping LDAP / AD / RADIUS Support Backup & Restore Configuration Remote BIOS/BMC/CPLD Update Event Log Filter User Management Media Redirection Settings PAM Order Settings SSL Settings SMTP Settings

OS Compatibility

Windows Server 2016 Windows Server 2019 Windows Server 2022 Red Hat Enterprise Linux 7.9 or later Red Hat Enterprise Linux 8.2 or later Red Hat Enterprise Linux 9.0) or later SUSE Linux Enterprise Server 12 SP5 or later SUSE Linux Enterprise Server 15 SP2 or later Ubuntu 20.04 LTS or later Ubuntu 22.04 LTS or later VMware ESXi 6.7 Update3 P03 or later VMware ESXi 7.0 Update2 or later VMware ESXi 8.0 or later Citrix Hypervisor 8.2.0 or later

System Fans

8 x 80x80x38mm (16,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C* Operating humidity: 8-80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20%-95% (non-condensing)

Weight

Net Weight: 27.2 kg

Packaging Dimensions

1180 x 779 x 300 mm

Packaging Content

1 x H262-PC2 8 x CPU heatsinks 1 x 3-Section Rail kit

Configuration options and limits depend on the exact product and revision. Confirm the proposed combination and the supplied parts before ordering; optional features are not necessarily included.

• Confirm the supplied revision and complete configuration before ordering. Supported options are not necessarily included.
• Specifications apply to revision 100. Other revisions require separate confirmation.
• Interface speeds and advertised limits are theoretical maxima. Actual performance depends on the installed configuration.
• Confirm the included hardware and accessories for the specific offer.

Processor and memory

Specify the intended workload, processor quantity, memory capacity and any existing parts to retain. Ask for a compatible processor and DIMM population for the exact system revision.

Storage layout

List the required drive type, capacity and bay arrangement. Confirm carriers, backplanes, RAID or HBA controllers and the complete cable set.

Expansion and cooling

Describe GPU and network requirements. Confirm the required risers, slot access, power connections and cooling provisions for the proposed build.

Rack and site requirements

Share available rack space, rack depth, power input and redundancy requirements. Agree on rails, regional power cords and the installation environment.