GIGABYTE H262-P60

Manufacturer

GIGABYTE

Model

H262-P60

Product type

Server systems

Revision

100

Dimensions (WxHxD, mm)

2U 4-Node - Rear access 440 x 87.5 x 840

Motherboard

MP62-HD0

CPU

Ampere® Altra® Max or Altra® Processor Dual processor, 7nm technology Up to 128-core per processor, TDP up to 190W NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable

Socket

Per Node: 2 x LGA 4926 Total: 8 x LGA 4926

Chipset

System on Chip

Memory

Per node: 16 x DIMM slots Total: 64 x DIMM slots DDR4 memory supported only 8-Channel memory per processor architecture RDIMM modules up to 256GB supported LRDIMM modules up to 256GB supported Up to 4TB of memory capacity supported per processor Memory speed: Up to 3200 MHz

LAN

Per node: 2 x 1GbE LAN ports (1 x Intel® I350-AM2) 1 x Dedicated management port Total: 8 x 1GbE LAN ports (4 x Intel® I350-AM2) 4 x Dedicated management ports 1 x 10/100/1000 *CMC port *CMC: Chassis Management Controller, to monitor all status of computing nodes

Video

Integrated in ASPEED® AST2600 x 4 - 4 x Mini-DP

Storage

Per node: 6 x 2.5" SATA hot-swappable bays Total: 24 x 2.5" SATA hot-swappable bays

SAS

N/A

RAID

N/A

Expansion Slots

Per node: Riser Card CRSH01E: - 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0 Riser Card CRSH01H: - 1 x PCIe x16 (Gen4 x16) low-profile slot, from CPU_0 1 x OCP 3.0 slot with PCIe Gen4 x8 or x16 bandwidth*, from CPU_0 1 x M.2 slot: - M-key - PCIe Gen4 x4, from CPU_0 - Supports 2280/22110 cards Total: Riser Card CRSH01E x 4: - 4 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0 Riser Card CRSH01H x 4: - 4 x PCIe x16 (Gen4 x16) low-profile slots, from CPU_0 4 x OCP 3.0 slots with PCIe Gen4 x8 or x16 bandwidth*, from CPU_0 4 x M.2 slots: - M-key - PCIe Gen4 x4, from CPU_0 - Supports 2280/22110 cards NOTE: Gen4 x16 available for Ampere Altra Max processor only

Internal I/O

Per node: 1 x M.2 slot 1 x TPM header 1 x BMC SGPIO header 1 x JTAG BMC header 1 x PLD header 1 x Clear CMOS jumper 1 x IPMB connector

Front I/O

Per node: 1 x Power button with LED 1 x ID button with LED 1 x Status LED 1 x System reset button Total: 4 x Power buttons with LED 4 x ID buttons with LED 4 x Status LEDs 4 x System reset buttons *1 x CMC status LED *Only one CMC status LED per system

Rear I/O

Per node: 2 x USB 3.2 Gen1 1 x Mini-DP 2 x RJ45 1 x RJ45 MLAN Total: 8 x USB 3.2 Gen1 4 x Mini DP 8 x RJ45 4 x RJ45 MLAN *1 x CMC port *Only one CMC port per system

Backplane Board

Speed and bandwidth: SATA 6Gb/s

TPM

1 x TPM header with SPI interface Optional TPM2.0 kit: CTM010

Power supply

Dual 2200W 80 PLUS Platinum redundant power supply AC Input: - 100-127V~/ 14A, 47-63Hz - 200-240V~/ 12.6A, 47-63Hz DC Input: - 240Vdc/ 12.6A DC Output: - Max 1200W/ 100-127V~ + 12.12V/ 95.6A + 12Vsb/ 3.5A - Max 2200W/ 200-240V~ + 12.12V/ 178.1A + 12Vsb/ 3.5A NOTE: System power supply requires C19 power cord Power cords are not included. Specify suitable cords separately.

System Management

ASPEED® AST2600 Baseboard Management Controller ASPEED® AST2520 Chassis Management Controller GIGABYTE Management Console web interface Dashboard HTML5 KVM Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.) Sensor Reading History Data FRU Information SEL Log in Linear Storage / Circular Storage Policy Hardware Inventory Fan Profile System Firewall Power Consumption Power Control Advanced power capping LDAP / AD / RADIUS Support Backup & Restore Configuration Remote BIOS/BMC/CPLD Update Event Log Filter User Management Media Redirection Settings PAM Order Settings SSL Settings SMTP Settings

OS Compatibility

Red Hat Enterprise Linux 8.3 or later Red Hat Enterprise Linux 8.5 or later SUSE Linux Enterprise Server 15 SP2 or later SUSE Linux Enterprise Server 15 SP3 or later Ubuntu 18.04.5 LTS or later Ubuntu 20.04.1 LTS or later Fedora Server 33-1.2 or later Fedora Server 35-1.2 or later OracleLinux R8 U2 OracleLinux R8 U5 Debian 10.9 Debian 11.1

System Fans

8 x 80x80x38mm (16,300rpm)

Operating Properties

Operating temperature: 10°C to 35°C Operating humidity: 8-80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20%-95% (non-condensing)

Packaging Dimensions

1180 x 779 x 300 mm

Packaging Content

1 x H262-P60 8 x CPU heatsinks 1 x 3-Section Rail Kit

Configuration options and limits depend on the exact product and revision. Confirm the proposed combination and the supplied parts before ordering; optional features are not necessarily included.

• Confirm the supplied revision and complete configuration before ordering. Supported options are not necessarily included.
• Specifications apply to revision 100. Other revisions require separate confirmation.
• Interface speeds and advertised limits are theoretical maxima. Actual performance depends on the installed configuration.
• Confirm the included hardware and accessories for the specific offer.

Processor and memory

Specify the intended workload, processor quantity, memory capacity and any existing parts to retain. Ask for a compatible processor and DIMM population for the exact system revision.

Storage layout

List the required drive type, capacity and bay arrangement. Confirm carriers, backplanes, RAID or HBA controllers and the complete cable set.

Expansion and cooling

Describe GPU and network requirements. Confirm the required risers, slot access, power connections and cooling provisions for the proposed build.

Rack and site requirements

Share available rack space, rack depth, power input and redundancy requirements. Agree on rails, regional power cords and the installation environment.