ASTER RACKIT — ITEM RFQ DRAFT
Not an offer, order, stock allocation or OEM-approved BOM.

Identifier: AMD EPYC™ 7373X
Manufacturer: AMD
Record type: processor-model
URL: https://www.aster-rackit.com/explore/product/amd-amd-epyc-7373x-f78425e9cc
Quantity: [enter]
Condition: [confirm]
Destination: [enter]

RECORDED TECHNICAL FIELDS — CHECK EVIDENCE STATUS
CPU cores: 16 [unverified_inherited]
Threads: 32 [unverified_inherited]
Base clock: 3.05 GHz [unverified_inherited]
Maximum boost clock: 3.8 GHz [unverified_inherited]
Default TDP: 240 W [unverified_inherited]
Configurable TDP: 225-280W [unverified_inherited]
Processor platform: SP3 [unverified_inherited]
Supported socket configurations: 1P / 2P [unverified_inherited]
L3 cache: 768 MB [unverified_inherited]
Memory type: DDR4 [unverified_inherited]
Memory channels: 8 [unverified_inherited]
Memory specification: Up to 3200 MT/s [unverified_inherited]
PCI Express: PCIe® 4.0 x128 [unverified_inherited]
Launch date: 03/22/2021 [unverified_inherited]
Title-derived · processor family: AMD EPYC [unverified_inherited]

PURCHASE CHECKS
1. Keep the model suffix and ordering code. A CPU model, tray code and OEM upgrade kit can describe different purchasing units.
2. Check the server generation, firmware and thermal support. A matching socket does not by itself prove compatibility.
3. For a multi-socket system, verify pairing requirements and include the correct heatsinks and carriers in the same review.
4. Record whether the offer is production silicon, an engineering sample or a qualification sample. Do not infer its status from the model name.
5. Request top-side markings, package photographs and the stated test scope before accepting a substitution.

PHOTO / EVIDENCE REQUIREMENTS
Top-side markings
Package underside where safe
Carrier or protective tray
Heatsink if included
Production or sample status

Confirm current exact identity, compatibility, stock, price, warranty and delivery terms with sales@aster-rackit.com.